measurements service
 
 
 
 
 
 
 

Application fields：

  • TSV
  • PCB: HDI, CSP, Flip Chip
  • Wafer foundry
  • Wafer packaging
  • LED
  • Wafer Golding Bumping
  • SMT
  • Solar Cell
  • MLCC
  • LTCC

3D contour metrology：(traced to ANSI/ NIST standards)

  • Roughness
  • Warpage
  • Coated film
  • Tilting
  • Glue thickness
  • Solder mask
  • Via hole
  • Routing
  • SMT measurement
  • Solder paste or Solder ball quality

 

 

KAITRONIC TECHNOLOGY CO., LTD.
Address：No.870, Sec. 3, Xinsheng Rd., Zhongli City, Taoyuan County 320, Taiwan
E-mail：service@kaitronic.com
TEL：+886-3-453-3569│FAX：+886-3-453-2113