Application fields:
- TSV
- PCB: HDI, CSP, Flip Chip
- Wafer foundry
- Wafer packaging
- LED
- Wafer Golding Bumping
- SMT
- Solar Cell
- MLCC
- LTCC
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3D contour metrology:(traced to ANSI/ NIST standards)
- Roughness
- Warpage
- Coated film
- Tilting
- Glue thickness
- Solder mask
- Via hole
- Routing
- SMT measurement
- Solder paste or Solder ball quality
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KAITRONIC TECHNOLOGY CO., LTD.
Address:4F.-3, No.400, Huanbei Rd., Zhongli City, Taoyuan County 320, Taiwan (R.O.C.)
E-mail:service@kaitronic.com
TEL:+886-3-425-3016 FAX:+886-3-425-9273