KIP Ⅲ

ViaCon TFM

Qualiline-C

AUDI / BMW - Landshut, Germany / Bosch / DaimlerChrysler - Stuttgart, Germany
General Electric - Hungary / GE - USA (Bridgeville) / General Motors-Powertrain
EpcosVolkswagen - Hannover, Germany / Hydro / Lander Carlisle / Le Belier
Musashi / Nemak - Monterrey, Mexico / NOKIA SAPU Temic / Trend Valeo Visteon
Ecomim Elcoteq FCI。

應用產業

• KIP Ⅲ
  PCB、WAFER、MEMS、IC-PACKAGING、MLCC、SOLAR BATTERY COATING、SOLDER BUMP、SMART CARD、CMOS industries。
• ViaCon TFM
  PCB & LTCC。
• Qualiline-C
  Car industry。

 

 

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