Application fields:
- TSV
- PCB: HDI, CSP, Flip Chip
- Wafer foundry
- Wafer packaging
- LED
- Wafer Golding Bumping
- SMT
- Solar Cell
- MLCC
- LTCC
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3D contour metrology:(traced to ANSI/ NIST standards)
- Roughness
- Warpage
- Coated film
- Tilting
- Glue thickness
- Solder mask
- Via hole
- Routing
- SMT measurement
- Solder paste or Solder ball quality
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KAITRONIC TECHNOLOGY CO., LTD.
Address:No.870, Sec. 3, Xinsheng Rd., Zhongli City,
Taoyuan County 320, Taiwan
E-mail:service@kaitronic.com
TEL:+886-3-453-3569│FAX:+886-3-453-2113